Taiwan Semiconductor is realizing its major research projects. They will have volume production of their 3 nanometer chips in 2021 and will get beyond to 2 nanometers and toward 1 nanometer chips in 2023-2025. 2020-2026, Taiwan semiconductor is working specialty on SoC (system on a chip) technology (including new NVM, MEMS, RF, analog) and transistors for 8 – 10 year out horizon. Beyond the 2nm node, they are working on more advanced 3D transistors, new memory and low-R interconnect. For 3D IC advanced packaging, TSMC is developing innovations for energy-efficient sub-system integration and scaling to provide further augmentation to CMOS
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