Taiwan Semiconductor Manufacturing Company (TSMC) plans to expand extreme ultraviolet (EUV) lithography tools for its next-generation 3 nm (N3) node process. TSMC was the first company to use ASML’s EUV lithography machines for high-volume production and now has at least three processes that use EUV for select layers. They use EUV lithography for its N7+, N6, and N5 nodes. TSMC’s 2nd generation 7 nm technology (N7+) uses EUV for up to four layers in order to reduce its use of multi-patterning techniques when building highly complex circuits. The 6 nm process (N6) is for customers to re-use IP designed for
The post Taiwan Semiconductor Will Have Volume Production of 3 Nanometer Chips in 2022 first appeared on NextBigFuture.com.
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